Chinese Materials Firm Says Its Low‑Dielectric Glass Fiber Is Being Used in High‑End 5G Phones and RF Parts

International Composite Materials told investors that its domestically developed low‑dielectric glass fibre for 5G has found use in high‑end phones and wave‑transparent parts for high‑frequency communications. The product, part of the firm's electronic cloth range used in PCBs, underscores China's push to domesticate advanced materials for RF hardware, though the company did not disclose scale or customer names.

Detailed view of a computer motherboard showcasing intricate electronic components.

Key Takeaways

  • 1International Composite Materials says its proprietary low‑dielectric glass fibre is already used in high‑end smartphones and 5G high‑frequency wave‑transparent components.
  • 2The material is part of the company’s electronic cloth line, a core input for PCBs where low dielectric loss is critical for RF performance.
  • 3The firm did not disclose production volumes, customers or technical metrics, so the commercial scale of adoption is unclear.
  • 4Domestic development of such materials supports China’s broader aim to reduce reliance on foreign suppliers for advanced telecom components.
  • 5Wider market impact depends on performance, certification by OEMs, and the company’s ability to scale manufacturing and quality control.

Editor's
Desk

Strategic Analysis

Editor's Take: The announcement is a useful indicator rather than a headline disruption. Materials for high‑frequency PCBs are a small but strategically sensitive segment of the telecom supply chain: they require tight manufacturing tolerances and long OEM qualification cycles. A domestic supplier claiming IP and initial applications signals progress toward supply‑chain resilience, but commercial effect will hinge on independent performance validation, customer qualification timelines and the company's ability to ramp to volume without defects. For investors and policymakers the key questions are whether the product can meet loss‑tangent and uniformity benchmarks demanded by global OEMs, and whether scale‑up will be rapid enough to matter before competing suppliers adapt or price pressure erodes margins. In short, this is an incremental but important step in China’s push to internalise advanced materials for the RF era — potentially consequential over the medium term, modest in the near term.

China Daily Brief Editorial
Strategic Insight
China Daily Brief

On January 23, International Composite Materials (301526.SZ) told investors that a low‑dielectric glass‑fibre it developed for 5G applications is already being used in high‑end smartphones and in key wave‑transparent components for 5G high‑frequency communications.

The company described the product as part of its electronic cloth lineup — a foundational material for printed circuit boards (PCBs). Low‑dielectric glass fibres reduce signal loss and dispersion at high frequencies, making them valuable for radio‑frequency PCB substrates, antenna windows and other parts where electromagnetic transparency and minimal dielectric loss are essential.

The announcement matters because materials such as low‑loss glass fibre are a technical bottleneck in the shift to higher‑frequency 5G (and, eventually, 6G) hardware. As devices move into millimetre‑wave bands and more complex RF front‑ends, board materials must combine mechanical strength with tightly controlled dielectric properties; domestic availability can shorten qualification cycles and ease supply constraints for handset and equipment makers.

International Composite Materials emphasised that the product is its own intellectual property and that specific application scenarios are determined by customers according to market demand. The company did not disclose volumes, named customers, or the performance metrics that would allow outsiders to judge how the material compares with entrenched foreign suppliers, so the scale and commercial significance of the adoption remain unclear.

That uncertainty notwithstanding, the development fits a broader Chinese industrial trend: moving up the value chain in components and materials that historically relied on foreign suppliers. If the material meets the stringent loss‑tangent and dielectric‑constant thresholds required by major OEMs, it could help localise parts of the 5G supply chain, reduce procurement risk for Chinese device makers and open modest export opportunities — though widespread displacement of established global suppliers will require sustained quality, capacity and certification efforts.

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