Samsung Electronics is repositioning its Device Solutions (DS) division to move beyond a defensive crouch in the memory market. After a period defined by intense competition in the DRAM and High Bandwidth Memory (HBM) sectors, the South Korean titan is reportedly reviving stalled research and investment into what it terms its future growth engines. This strategic pivot suggests that Samsung feels its core memory business has reached a level of stability that allows for renewed long-term risk-taking.
The focus of this renewed push centers on three pivotal technological frontiers: tenth-generation NAND flash (V10), compound semiconductors, and glass substrates. By engaging with its supply chain partners to finalize investment schedules, Samsung is signaling a readiness to compete on the bleeding edge of power efficiency and storage density. This move comes as the global semiconductor industry undergoes a radical transformation fueled by the generative artificial intelligence boom.
In the NAND space, Samsung is accelerating its V10 project, targeting a staggering 400-layer vertical stack. To overcome the physical limitations of such deep structures, the company is finalizing selections for cryogenic etching equipment, a sophisticated process required for high-precision channel holes. Furthermore, the adoption of wafer-to-wafer (W2W) bonding and advanced laser processing indicates a shift toward manufacturing techniques that maximize yield and electrical performance in ultra-dense chips.
Beyond storage, Samsung is doubling down on compound semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN). These materials are increasingly vital for electric vehicles and high-frequency communications where traditional silicon reaches its thermal and efficiency limits. While mass production of SiC is not slated until 2028, the establishment of pilot lines by 2027 marks a clear intent to challenge current market leaders in the power electronics segment.
Finally, the exploration of glass substrates represents a major shift in advanced packaging. Glass offers superior flatness and thermal stability compared to organic materials, making it ideal for the massive, high-performance chiplets required by AI data centers. By diversifying its supply chain and analyzing glass substrate quality now, Samsung aims to integrate this technology into its broader AI solution suite, potentially including its next-generation SoC-AMM modules for clients like Nvidia.