# 3D NAND

SanDisk’s Vertical Leap: The 332-Layer Breakthrough in the Global Memory Race

SanDisk has introduced its 10th-generation BiCS10 3D NAND flash memory, featuring a record-breaking 332-layer architecture and 1Tb TLC capacity. The technology integrates DDR6.0 and advanced power-saving protocols to meet the high-performance demands of AI and data center applications.

NeTe2026年7月3日 01:38

#SanDisk#3D NAND#Semiconductors

Technology

China’s Memory King Prepares for Market Debut: How Wuhan’s ‘Optical Valley’ Became a Tech Powerhouse

YMTC has launched its IPO process, signaling a major victory for China's state-led semiconductor strategy. The listing is expected to create one of the country's most valuable tech entities, highlighting the emergence of Wuhan as a critical global hub for AI hardware and memory technology.

SoBiz2026年5月20日 06:23

#YMTC#Semiconductors#3D NAND