# Advanced%20Packaging
Latest news and articles about Advanced%20Packaging
Total: 17 articles found
Breaking the Seal: China’s Aisen Stock Secures Orders for Critical AI Chip Material
Aisen Stock has successfully commercialized its self-developed low-temperature PSPI, a critical material for advanced semiconductor packaging used in AI chips. This achievement disrupts a long-standing foreign monopoly and advances China's domestic substitution strategy for high-end electronic chemicals.
Beyond the Die: How Advanced Packaging is Rewriting the Semiconductor Rulebook
At SEMICON China 2026, Henkel's Ram Trichur emphasized that 2.5D and 3D packaging have become the primary drivers of AI performance. As the industry faces massive thermal and structural challenges, the focus is shifting toward material innovation, AI-assisted R&D, and sustainable manufacturing to overcome the physical limits of traditional silicon scaling.
SMIC’s High-Stakes Pivot: Chasing Advanced Packaging as the Next Frontier in China’s Silicon Shield
SMIC reported strong 2025 growth but faces margin pressure from a massive $37 billion expansion drive and a missed AI storage boom. The company’s strategic pivot toward advanced packaging signals a new phase in China's pursuit of semiconductor self-reliance, focusing on system-level performance to bypass lithography limitations.
The Trillion-Dollar Silicon Sprint: AI and Memory Bottlenecks Pull the Semiconductor Future Forward
The semiconductor industry is on track to hit $1 trillion by late 2026, driven by a $450 billion surge in AI infrastructure and a critical 60% supply shortage in High Bandwidth Memory (HBM). High costs for 2nm manufacturing are shifting the industry's focus toward advanced packaging as the new primary driver of performance gains.
Scaling the Silicon Wall: China’s EDA Sector Pivots to System-Level Design
Chinese EDA firms are pivoting from single-chip design to System Technology Co-optimization (STCO) to bypass the physical limits of Moore's Law. This strategic shift aims to create a domestic 'full-stack' toolchain capable of designing complex AI supernodes and advanced packaging, matching the systemic integration trend led by global giants like Synopsys and Cadence.