# Silicon photonics

Micro‑LED 'Chip‑on‑Panel' Could Cut Data‑Centre Intra‑Rack Power to 5% of Copper, TrendForce Says

TrendForce says Micro‑LED chip‑on‑panel (CPO) interconnects could shrink intra‑rack transmission energy to about 5% of copper cabling, a change driven by surging bandwidth needs from generative AI. The technology promises big operational savings and higher port density but must overcome manufacturing, coupling and standardization hurdles before it can displace existing optical and copper solutions.