# hybrid bonding

Wuhan Firm Claims Breakthrough in Nanometre-Precision Chip Bonding, Pushing China’s Packaging Ambitions Forward

Wuhan Xinlik Technology says it has developed a domestically built semiconductor hybrid‑bonding machine that achieves nanometre‑level precision and is entering validation with chipmakers. The move, if validated at scale, would chip away at foreign dominance in a critical advanced‑packaging step and support China’s drive for greater semiconductor self‑reliance.