As the physical limits of silicon-based microelectronics loom on the horizon, the global semiconductor industry is bracing for the end of Moore’s Law. In China, this approaching ceiling has sparked a conceptual revolution led by the nation’s scientific elite. Academician Chu Junhao, a luminary in infrared physics and a member of the Chinese Academy of Sciences, argues that the focus of innovation must shift from traditional geometric scaling to architectural time-efficiency.
At the heart of this transition is 'Tao’s Law,' a paradigm recently popularized by Huawei that prioritizes 'time scaling' over 'size scaling.' While Moore’s Law dictated that transistor density should double every two years, Tao’s Law suggests that performance gains can be achieved by minimizing the RC (resistance-capacitance) time constant. By focusing on 3D structures and integrated circuit architecture, engineers can reduce latency and increase clock speeds even when physical dimensions cannot be further shrunk.
Chu Junhao, whose own 'CXT Formula' revolutionized infrared material science, views this as a necessary evolution for a post-Moore era. He notes that as chip processes approach the 1-nanometer threshold, quantum tunneling effects begin to degrade performance, rendering traditional scaling obsolete. Tao’s Law provides a roadmap for using physical logic to drive development in emerging fields such as quantum and photonic chips.
The geopolitical subtext of this scientific shift is impossible to ignore. Western restrictions on Extreme Ultraviolet (EUV) lithography have effectively boxed China out of the traditional race to the bottom of the nanometer scale. Rather than admitting defeat, Chinese researchers are using these constraints to 'force' a breakthrough in alternative pathways, viewing the combination of Tao’s Law and future lithography as a '1+1 > 2' strategic advantage.
However, Chu remains a realist regarding the challenges ahead. While Tao’s Law offers a way to bypass current bottlenecks, it introduces its own hurdles, such as increased heat dissipation issues as 3D density grows. He emphasizes that for China to truly lead rather than follow, it must deepen its commitment to fundamental research rather than merely seeking immediate commercial products. The goal is to move from 'following rules' to 'defining paradigms.'