# 2nm

AI’s Insatiable Appetite: TSMC Accelerates 2nm Expansion at Breakneck Speed

TSMC is doubling the pace of its 2nm capacity expansion to meet surging AI and HPC demand, with five fabs set to ramp up production simultaneously. The company expects first-year output for 2nm to surpass 3nm levels by 45%, signaling a rapid industry-wide shift to next-generation silicon.

NeTe2026年4月28日 01:29

#TSMC#2nm#Semiconductors

Close-up of neatly stacked red and blue casino chips on a gaming table.

Technology

Broadcom's 3.5D Gamble: Stacked 2nm SoCs and a Push for a Million AI Chips by 2027

Broadcom has started shipping a custom 2nm compute SoC built on a hybrid 3.5D stacking platform and aims to sell at least one million stacked chips by 2027. The XDSiP approach combines 2.5D interposers with face‑to‑face 3D bonding to boost bandwidth and energy efficiency, offering customers an alternative to monolithic node scaling.

NeTe2026年2月26日 20:07

#Broadcom#3.5D XDSiP#chip stacking