# Advanced Packaging

Scaling the Silicon Wall: China’s EDA Sector Pivots to System-Level Design

Chinese EDA firms are pivoting from single-chip design to System Technology Co-optimization (STCO) to bypass the physical limits of Moore's Law. This strategic shift aims to create a domestic 'full-stack' toolchain capable of designing complex AI supernodes and advanced packaging, matching the systemic integration trend led by global giants like Synopsys and Cadence.