# Advanced Packaging
Latest news and articles about Advanced Packaging
Total: 8 articles found
China’s Silicon Shield: STAR Market Chipmakers Hit Full Capacity Amid Global AI Fever
Leading Chinese semiconductor firms on the STAR Market have reported full capacity utilization for Q1, driven by surging demand for AI and automotive electronics. The industry is pivoting toward advanced packaging and specialty manufacturing to capitalize on the global AI infrastructure build-out and domestic self-sufficiency goals.
Intel’s Packaging Breakthrough Challenges TSMC’s AI Hegemony
Intel has achieved a 90% yield for its EMIB-T advanced packaging, positioning itself to win Google's next-generation TPU v8e contract. This technical milestone offers a viable alternative to TSMC's capacity-constrained CoWoS packaging for AI chip designers looking for better cost and power efficiency.
Chuangda Materials Anchors China’s Semiconductor Ambitions with New Advanced Packaging Base
Chuangda New Materials has committed 110 million RMB to build a semiconductor packaging material production line in Wuxi. The project targets the high-end materials market, aiming to produce over 2,000 tons of packaging materials annually to bolster China's domestic chip supply chain.
Breaking the Seal: China’s Aisen Stock Secures Orders for Critical AI Chip Material
Aisen Stock has successfully commercialized its self-developed low-temperature PSPI, a critical material for advanced semiconductor packaging used in AI chips. This achievement disrupts a long-standing foreign monopoly and advances China's domestic substitution strategy for high-end electronic chemicals.
Beyond the Die: How Advanced Packaging is Rewriting the Semiconductor Rulebook
At SEMICON China 2026, Henkel's Ram Trichur emphasized that 2.5D and 3D packaging have become the primary drivers of AI performance. As the industry faces massive thermal and structural challenges, the focus is shifting toward material innovation, AI-assisted R&D, and sustainable manufacturing to overcome the physical limits of traditional silicon scaling.
SMIC’s High-Stakes Pivot: Chasing Advanced Packaging as the Next Frontier in China’s Silicon Shield
SMIC reported strong 2025 growth but faces margin pressure from a massive $37 billion expansion drive and a missed AI storage boom. The company’s strategic pivot toward advanced packaging signals a new phase in China's pursuit of semiconductor self-reliance, focusing on system-level performance to bypass lithography limitations.
The Trillion-Dollar Silicon Sprint: AI and Memory Bottlenecks Pull the Semiconductor Future Forward
The semiconductor industry is on track to hit $1 trillion by late 2026, driven by a $450 billion surge in AI infrastructure and a critical 60% supply shortage in High Bandwidth Memory (HBM). High costs for 2nm manufacturing are shifting the industry's focus toward advanced packaging as the new primary driver of performance gains.
Scaling the Silicon Wall: China’s EDA Sector Pivots to System-Level Design
Chinese EDA firms are pivoting from single-chip design to System Technology Co-optimization (STCO) to bypass the physical limits of Moore's Law. This strategic shift aims to create a domestic 'full-stack' toolchain capable of designing complex AI supernodes and advanced packaging, matching the systemic integration trend led by global giants like Synopsys and Cadence.