# COUPE

Light Speed: TSMC Reimagines AI Hardware with Silicon Photonics and the ‘Three-Layer’ Architecture

TSMC has introduced a 'three-layer' hardware strategy for AI, prioritizing silicon photonics and its COUPE integration technology to overcome current power and latency bottlenecks. By moving from copper to optical interconnects, the company aims to deliver massive efficiency gains, cementing its role as the critical system integrator for the future of AI data centers.