# Fujitsu

Broadcom's 3.5D Gamble: Stacked 2nm SoCs and a Push for a Million AI Chips by 2027

Broadcom has started shipping a custom 2nm compute SoC built on a hybrid 3.5D stacking platform and aims to sell at least one million stacked chips by 2027. The XDSiP approach combines 2.5D interposers with face‑to‑face 3D bonding to boost bandwidth and energy efficiency, offering customers an alternative to monolithic node scaling.