# Laser Manufacturing

Beyond Silicon: DR Laser’s Milestone Shipment Signals China’s Move into Glass Substrate Packaging

Wuhan DR Laser has successfully shipped its first panel-level TGV equipment for glass substrates, a move that places the company at the heart of the next generation of semiconductor packaging. This technology is crucial for AI and high-performance computing as the industry shifts away from traditional organic substrates to glass for better thermal and electrical performance.