# Semiconductor Foundry

Latest news and articles about Semiconductor Foundry

Total: 4 articles found

Detailed close-up of a laptop keyboard featuring Intel Core i7 and NVIDIA GeForce stickers, highlighting technology components.
Technology

Samsung and Nvidia Forge Strategic Alliance to Tackle the HBM4 Frontier

Samsung's semiconductor chief and Nvidia's CEO have outlined an extensive roadmap for collaboration, spanning next-generation HBM4 and HBM5 memory alongside advanced foundry services. This strategic alignment aims to solidify Samsung's role in the AI infrastructure boom and expand their partnership into the high-growth autonomous vehicle sector.

NeTe2026年6月8日 10:08
#Samsung Electronics#Nvidia#HBM4
Close-up view of a hand holding an Intel Core i9 processor chip, showcasing technology details.
Technology

The Silicon Arm-Twist: Is Washington Forcing a Marriage Between Tesla and Intel?

Rumors suggest the Trump administration is pressuring Tesla to move its AI6 chip production to Intel's foundries to bolster domestic manufacturing optics. This shift threatens Tesla's existing plans with Samsung and TSMC, raising concerns about Intel's ability to meet the technical requirements of next-generation AI hardware.

NeTe2026年5月12日 08:23
#Intel#Tesla#AI6 Chip
Close-up view of a hand holding an Intel Core i9 processor chip, showcasing technology details.
Technology

Beyond the TSMC Monopoly: Apple Courts Intel and Samsung in High-Stakes Silicon Search

Apple has initiated exploratory talks with Intel and Samsung to diversify its processor manufacturing and reduce its total dependence on TSMC. While no formal orders have been placed, the move highlights Apple's long-term strategy to mitigate supply chain risks and leverage US-based manufacturing.

NeTe2026年5月5日 07:23
#Apple#Intel#Samsung
Close-up view of a hand holding an Intel Core i9 processor chip, showcasing technology details.
Technology

Intel’s Packaging Breakthrough Challenges TSMC’s AI Hegemony

Intel has achieved a 90% yield for its EMIB-T advanced packaging, positioning itself to win Google's next-generation TPU v8e contract. This technical milestone offers a viable alternative to TSMC's capacity-constrained CoWoS packaging for AI chip designers looking for better cost and power efficiency.

NeTe2026年5月4日 05:23
#Intel#Google TPU#Advanced Packaging