# Thermal Management

Beyond the Die: How Advanced Packaging is Rewriting the Semiconductor Rulebook

At SEMICON China 2026, Henkel's Ram Trichur emphasized that 2.5D and 3D packaging have become the primary drivers of AI performance. As the industry faces massive thermal and structural challenges, the focus is shifting toward material innovation, AI-assisted R&D, and sustainable manufacturing to overcome the physical limits of traditional silicon scaling.