# Thermal Management
Latest news and articles about Thermal Management
Total: 7 articles found
Cooling the Dragon: GRINM Powder Reveals Exclusive Material Link to Huawei’s AI Ambitions
GRINM Powder has confirmed its role as the exclusive, co-development partner providing advanced cooling copper powder for Huawei’s Ascend 910 AI chips. This partnership highlights the critical role of specialized materials in China’s push to build high-performance AI hardware capable of bypassing Western sanctions.
Cooling the Dragon: Lopal Technology Enters Huawei’s Elite Data Center Supply Chain
Lopal Technology's subsidiary has earned technical certification from Huawei for its data center liquid cooling solutions. As one of only three approved vendors, Lopal is now positioned as a critical supplier for China's high-density AI and GPU cluster infrastructure.
The 'Tuition' Defense: Sanhua Intelligent’s Executive Sell-Off Sparks Governance Outcry
Sanhua Intelligent Controls is facing a public relations crisis after executives justified selling millions in stock at peak prices by citing 'children's education' costs. The divestments occurred just before a significant slowdown in profit growth and a 20% drop in share price, raising concerns over corporate governance.
Diamonds Are a GPU's Best Friend: China's Synthetic Gem Makers Pivot to AI
China's synthetic diamond manufacturers are pivoting from the collapsing jewelry market to the AI sector, as their products become essential for cooling high-power GPUs. With Nvidia adopting diamond-composite cooling solutions and China controlling 63% of global capacity, the industry is seeing a massive valuation surge.
The Cold Truth: China’s Liquid Cooling Giant Struggles to Profit from the AI Boom
Invic, a leading Chinese liquid cooling firm, reported an 82% drop in Q1 2026 net profit despite rising revenues, highlighting a severe 'growth without profit' crisis. The company is struggling with high raw material costs and intense competition as the AI data center cooling market becomes increasingly commoditized.
From Beverage Caps to Data Centers: China’s ‘Bottle Cap King’ Places a $79 Million Bet on Liquid Cooling
Chinese packaging giant Jinfu Technology is pivoting to the liquid cooling industry after reporting a 28.5% drop in net profit for 2025. The company is investing 571 million yuan to acquire majority stakes in two thermal management firms, seeking to escape the low-margin beverage sector for the high-growth AI infrastructure market.
Beyond the Die: How Advanced Packaging is Rewriting the Semiconductor Rulebook
At SEMICON China 2026, Henkel's Ram Trichur emphasized that 2.5D and 3D packaging have become the primary drivers of AI performance. As the industry faces massive thermal and structural challenges, the focus is shifting toward material innovation, AI-assisted R&D, and sustainable manufacturing to overcome the physical limits of traditional silicon scaling.