# advanced packaging
Latest news and articles about advanced packaging
Total: 4 articles found
Wuhan Firm Claims Breakthrough in Nanometre-Precision Chip Bonding, Pushing China’s Packaging Ambitions Forward
Wuhan Xinlik Technology says it has developed a domestically built semiconductor hybrid‑bonding machine that achieves nanometre‑level precision and is entering validation with chipmakers. The move, if validated at scale, would chip away at foreign dominance in a critical advanced‑packaging step and support China’s drive for greater semiconductor self‑reliance.
Broadcom's 3.5D Gamble: Stacked 2nm SoCs and a Push for a Million AI Chips by 2027
Broadcom has started shipping a custom 2nm compute SoC built on a hybrid 3.5D stacking platform and aims to sell at least one million stacked chips by 2027. The XDSiP approach combines 2.5D interposers with face‑to‑face 3D bonding to boost bandwidth and energy efficiency, offering customers an alternative to monolithic node scaling.
China Stocks Open Higher as Chip and Storage Names Lead a Tech-Heavy Rally
Chinese stock markets opened higher as semiconductor and storage‑chip stocks outperformed, buoyed by company profit forecasts and plans to expand wafer‑level packaging capacity. Broader market moves were uneven, with commodity and precious‑metals names lagging and speculative small‑caps showing continued volatility.
Washington’s 100% Tariff Ultimatum Forces Chipmakers to Choose: Pay or Build
The U.S. has begun imposing tariffs on certain imported semiconductors and warned foreign memory makers that failure to expand production on U.S. soil could trigger duties up to 100%. South Korea’s government and firms such as SK Hynix are urgently reassessing strategy amid rising uncertainty, while the policy risk accelerates a geopolitical reorganisation of global chip supply chains.