Analyst Ming-Chi Kuo wrote on June 11, 2026 that he expected TSMC’s CoPoS advanced packaging to enter mass production in the second half of 2028. This is his forecast, rather than a confirmed TSMC launch date.
Kuo describes a glass core between ABF build-up layers. He says glass does not replace ABF and chips attach to the ABF surface, rather than directly to glass.
Editorial update, October 8, 2026: The brief now attributes the timetable and technical description to Kuo’s original post. Predictions about market dominance and future AI workloads have been removed. The original publication date is retained.
Verification source: https://medium.com/@mingchikuo/key-takeaways-on-tsmcs-next-generation-advanced-packaging-copos-16120c976fbc