# CoWoS
Latest news and articles about CoWoS
Total: 3 articles found
The Trillion-Dollar Silicon Bet: Mapping the AI Infrastructure Boom Through TSMC’s Lens
Analyses of TSMC's production data suggest that global AI capital expenditure is on track to surpass $1.1 trillion by 2027. This infrastructure boom is fueled by the transition to more complex architectures like Nvidia’s Rubin and the increasing value of advanced packaging technologies.
Light Speed: TSMC Reimagines AI Hardware with Silicon Photonics and the ‘Three-Layer’ Architecture
TSMC has introduced a 'three-layer' hardware strategy for AI, prioritizing silicon photonics and its COUPE integration technology to overcome current power and latency bottlenecks. By moving from copper to optical interconnects, the company aims to deliver massive efficiency gains, cementing its role as the critical system integrator for the future of AI data centers.
When Memory Rules: How HBM Is Rewriting the Economics of AI Chips
The AI chip competition has pivoted from raw compute to memory capacity and bandwidth as HBM and advanced packaging now dominate costs and performance requirements. Persistent HBM shortages and soaring prices favour cloud buyers who prioritise memory-rich GPUs and push chipmakers toward software and system optimisations to reduce memory demand.