# Semiconductor Packaging
Latest news and articles about Semiconductor Packaging
Total: 6 articles found
Adhesive Breakthrough: Huitian New Materials Bolsters China's Chip Packaging Supply Chain
Huitian New Materials has successfully moved its semiconductor packaging adhesives into the commercial supply and verification stage. With its Guangzhou facility now actively fulfilling orders, the company is positioning itself as a key domestic provider of specialized materials critical to China's chip-making independence.
Beyond Silicon: DR Laser’s Milestone Shipment Signals China’s Move into Glass Substrate Packaging
Wuhan DR Laser has successfully shipped its first panel-level TGV equipment for glass substrates, a move that places the company at the heart of the next generation of semiconductor packaging. This technology is crucial for AI and high-performance computing as the industry shifts away from traditional organic substrates to glass for better thermal and electrical performance.
Shattering the Silicon Ceiling: DR Laser Hits Milestone in Glass Substrate Packaging
Chinese equipment maker DR Laser has shipped its first panel-level Through Glass Via (TGV) laser systems, signaling a major breakthrough in glass substrate packaging for AI and semiconductor chips. The company now offers comprehensive laser solutions for both wafer-level and panel-level high-performance packaging.
The Middle East Tax: Sumitomo Bakelite’s Price Hike Signals Rising Costs for the Global Chip Supply Chain
Sumitomo Bakelite will raise prices for its semiconductor epoxy molding compounds by 10-20% starting June 2026, citing Middle East instability and rising logistical costs. The move underscores the vulnerability of the semiconductor back-end supply chain to geopolitical and energy market fluctuations.
Chuangda New Materials Bolsters China’s Chip Ambitions with $15 Million Packaging Play
Chuangda New Materials is investing 110 million RMB in a new facility in Wuxi to produce 2,128 tons of semiconductor packaging materials annually. The move is a strategic effort to localize critical components in the chip supply chain as advanced packaging becomes essential for future semiconductor performance.
IRICO Tempers Expectations as Chinese Glass Substrate Ambitions Hit R&D Reality
Chinese display glass giant IRICO has clarified that its foray into semiconductor packaging glass substrates remains in the R&D stage, tempering market speculation. The move highlights the technical challenges Chinese firms face in pivoting from display technology to high-end chip packaging amid global competition.