# Semiconductor Packaging
Latest news and articles about Semiconductor Packaging
Total: 5 articles found
Beyond Silicon: DR Laser’s Milestone Shipment Signals China’s Move into Glass Substrate Packaging
Wuhan DR Laser has successfully shipped its first panel-level TGV equipment for glass substrates, a move that places the company at the heart of the next generation of semiconductor packaging. This technology is crucial for AI and high-performance computing as the industry shifts away from traditional organic substrates to glass for better thermal and electrical performance.
Shattering the Silicon Ceiling: DR Laser Hits Milestone in Glass Substrate Packaging
Chinese equipment maker DR Laser has shipped its first panel-level Through Glass Via (TGV) laser systems, signaling a major breakthrough in glass substrate packaging for AI and semiconductor chips. The company now offers comprehensive laser solutions for both wafer-level and panel-level high-performance packaging.
The Middle East Tax: Sumitomo Bakelite’s Price Hike Signals Rising Costs for the Global Chip Supply Chain
Sumitomo Bakelite will raise prices for its semiconductor epoxy molding compounds by 10-20% starting June 2026, citing Middle East instability and rising logistical costs. The move underscores the vulnerability of the semiconductor back-end supply chain to geopolitical and energy market fluctuations.
Chuangda New Materials Bolsters China’s Chip Ambitions with $15 Million Packaging Play
Chuangda New Materials is investing 110 million RMB in a new facility in Wuxi to produce 2,128 tons of semiconductor packaging materials annually. The move is a strategic effort to localize critical components in the chip supply chain as advanced packaging becomes essential for future semiconductor performance.
IRICO Tempers Expectations as Chinese Glass Substrate Ambitions Hit R&D Reality
Chinese display glass giant IRICO has clarified that its foray into semiconductor packaging glass substrates remains in the R&D stage, tempering market speculation. The move highlights the technical challenges Chinese firms face in pivoting from display technology to high-end chip packaging amid global competition.