# TSMC
Latest news and articles about TSMC
Total: 43 articles found
Intel’s Packaging Breakthrough Challenges TSMC’s AI Hegemony
Intel has achieved a 90% yield for its EMIB-T advanced packaging, positioning itself to win Google's next-generation TPU v8e contract. This technical milestone offers a viable alternative to TSMC's capacity-constrained CoWoS packaging for AI chip designers looking for better cost and power efficiency.
Apple’s Silicon Squeeze: Cook Warns of Protracted Mac Shortages Amid Rising Component Costs
Apple CEO Tim Cook has warned that Mac supply will remain constrained for several months due to advanced chip production limits and rising memory prices. The company expects significant cost pressures to emerge after June, necessitating internal strategic countermeasures to manage margins.
AI’s Insatiable Appetite: TSMC Accelerates 2nm Expansion at Breakneck Speed
TSMC is doubling the pace of its 2nm capacity expansion to meet surging AI and HPC demand, with five fabs set to ramp up production simultaneously. The company expects first-year output for 2nm to surpass 3nm levels by 45%, signaling a rapid industry-wide shift to next-generation silicon.
Tech Triumphant: TSMC and CATL Lead a Global Pivot as Traditional Icons Falter
Global markets are undergoing a major transition as AI-driven tech stocks and battery giants like CATL reach record valuations, while traditional consumer leaders like Kweichow Moutai face historic declines. Amidst this economic shift, escalating US sanctions on Iran and administrative friction between the US and China continue to inject volatility into the geopolitical landscape.
Tesla’s Silicon Sovereignty: Musk Signals Mass Production for Next-Gen AI5 Chips
Tesla has successfully taped out its new AI5 chip, signaling a major step toward mass production of its proprietary AI hardware. Supported by partners like TSMC and Samsung, the company is also developing AI6 and Dojo3 to maintain its lead in autonomous driving and robotics.
Samsung’s Dynastic Tax Bill Settled: Jay Y. Lee Bets $84 Billion on an AI Rebirth
The Lee family has completed the payment of a historic $9 billion inheritance tax, allowing Jay Y. Lee to solidify his control and launch a massive $84 billion investment plan. Samsung is now pivoting aggressively toward AI-centric semiconductors and hybrid manufacturing to challenge industry leaders like TSMC and NVIDIA.
A Ten-Day Countdown to Darkness: The Qatari Gas Crisis and the Remaking of Asian Energy Geopolitics
The closure of the Strait of Hormuz and strikes on Qatari gas facilities have triggered a 10-day countdown to an energy crisis in Asia, forcing nations to pivot toward US LNG and nuclear power. The disruption threatens not only global electricity markets but also the semiconductor industry due to a critical shortage of helium.
Apple’s M5 MacBooks: AI Muscle Up, Starter Storage Cuts — A Pricing Play to Absorb Rising Memory Costs
Apple’s new M5 MacBooks deliver significant on‑device AI and GPU performance gains enabled by TSMC’s SoIC‑MH packaging, while the company has raised base storage and retail prices by cutting lower‑capacity SKUs. The strategy appears designed to absorb rising NAND and DRAM costs, protect margins and push more customers toward higher‑priced configurations.
Apple Prepares a Major UI Shift: Touch‑Capable MacBook Pro Pencilled for Late‑2026
Apple will keep Mac and iPad as separate product lines but is preparing a touch‑enabled MacBook Pro for late 2026 featuring Samsung OLED panels, Dynamic Island and new M6 chips on TSMC’s 2nm node. The device will be touch‑friendly rather than touch‑first, preserving keyboard and trackpad interaction while expanding macOS’s gesture capabilities.
Blowout Quarter, Tepid Market: Nvidia’s Strong Results Undercut by AI‑Monetisation Fears and an Uncertain OpenAI Pact
Nvidia posted a stellar quarter driven by its data‑centre GPUs and issued an aggressive revenue guide, yet the stock fell over 5% as investors fretted about the sustainability of AI capex, lofty valuations and uncertainty around a large potential OpenAI investment. The rout hit other chip names too, reflecting concern about demand sensitivity to hyperscaler spending and a market shift from training to inference workloads.
Broadcom's 3.5D Gamble: Stacked 2nm SoCs and a Push for a Million AI Chips by 2027
Broadcom has started shipping a custom 2nm compute SoC built on a hybrid 3.5D stacking platform and aims to sell at least one million stacked chips by 2027. The XDSiP approach combines 2.5D interposers with face‑to‑face 3D bonding to boost bandwidth and energy efficiency, offering customers an alternative to monolithic node scaling.
Jensen Huang’s Taipei Night: Nvidia Reaffirms Taiwan Ties as Supply Chain Faces a ‘Very Tight’ 2026
Nvidia CEO Jensen Huang hosted nearly 40 senior Taiwanese supply‑chain executives in Taipei, using the occasion to thank partners, apologise for recent production disruptions around the Grace Blackwell platform, and warn that 2026 will be "extremely tight" for memory and packaging supply. He confirmed Nvidia’s participation in OpenAI’s next financing round, reaffirmed the company’s full‑stack strategy versus ASIC competition, and underlined Taiwan’s indispensable role in Nvidia’s success.